Closing Date:
Status:
Open
Funding Type:
Fund:
Research Grant
Applicants:
Activity Country:
Citizenship:
Residency:
Duration:
2 Years
Published Date:
The Department of Science & Technology (DST), through its Technology Translation & Innovation (TTI) division, is inviting project proposals under the Advanced Manufacturing Technologies (AMT) Program. This initiative aims to foster technology development and translation in the manufacturing sector, bridging the gap between research and practical application.
This call focuses on translational research within specific areas of Advanced Manufacturing Technologies (AMT). The program aims to support projects that address limitations in conventional manufacturing, promote indigenous development, improve materials processing, and enhance resource utilization through ICT.
Emphasis is placed on "Industry 4.0" enablers, including additive manufacturing, near net shape manufacturing, assistive robotics, process automation, industrial IoT implementation, and AI/ML-aided smart manufacturing. Proposals should align with one of the specified thrust areas and associated topics.
Here are some of the thrust areas and topics:
Additive Manufacturing: Development of qualification protocols, novel mechanical testing methodologies, refurbishment methodologies, defect-free printing of reflective materials, 4D printing of biopolymers, hybrid manufacturing methodologies, and techniques for fabricating components using advanced magnetic materials.
Sheet Metal Forming: Die-less forming techniques for automobile, aerospace, and bio-medical applications, and formability enhancement at room temperature through energy-assisted technologies.
Welding/Casting/Forming Techniques: Challenging problems related to friction welding, friction stir welding, LASER welding, e-beam welding, linear friction welding, or Gas tungsten arc (GTA) welding, 3D printing for mold-making, improving process efficiency, and integrating with modern digital tools, integration of forming with AM, development of other hybrid processes, high-speed forming, and precision forging, and micro forming for sensor housing and accessories.
Processing of Advanced Materials: AI/ML-assisted design and processing of new alloys for light-weighting, bulk processing methods of advanced magnetic materials, development of formable structural ceramics and operational-ceramic waveguides and antennas for 5G–Sub6GHz communication applications, processes for biodegradable and other packaging materials, and developing hydrogen embrittlement-resistant materials.
Surface Engineering: Development of highly thermally and electrically conductive and wear-resistant coatings for rapid transport systems, hard and conductive coatings for arc erosion applications, deposition of large to very large area thin film for various applications, and recycling and reuse of powder waste for coatings and/or powder metallurgical applications.
Development of Advanced Machines, equipment, Tooling, Instruments and critical subsystems including Smart Machines: Development of automated furnace for graphitization, manufacturing processes for Microfluidic systems and devices manufacturing, indigenous development low-temperature cold spray machines for repairing lustrous and reflective metals and alloys, high-end instruments and aggregates, toolings and critical consumables, cost effective manufacturing methodologies for engineering of advanced medical equipment and devices, Smart Manufacturing and Industry 4.0 solutions/systems, and Testing, inspection and calibration equipments.
Electromagnetic spectrum management; cybersecurity and navigation; communication systems: Development of anti-Jamming and anti-spoofing antenna for protecting critical communication and navigation systems from malicious interference, end-to-end fabrication of THz systems sensing, imaging, ultrafast semiconductor devices, wireless communication, and RADAR applications, and end-to-end fabrication of table-top operational and preferably high-resolution spectroscopic systems.
This call is open to Faculty/Scientists/Engineers/Technologists working in Indian Universities and other Academic institutions, R&D institutions/ Laboratories having adequate infrastructure and facilities to carry out R&D work. Applicants must register as a PI in DST’s Online Portal to submit proposals.
Collaborative projects are mandatory, requiring both a research team and a translation team. The translation team must include a Technology Enabling Center (TEC) or a Technology Business Incubator (TBI) established by DST. Industry participation is also mandatory, with a 10% contribution in cash.
Research Team: Collaborative, multi-institutional, and multidisciplinary projects are encouraged, with each participating institution represented by Principal Investigators (PIs) and Co-PIs.
Translation Team: Engagement with TECs or TBIs is crucial for technology demonstration, industry engagement, validation of economic viability, and intellectual property management.
Financial support is provided for temporary staff salaries, equipment (specific to project requirements), prototype building, consumables, and domestic travel. Support is not provided for basic infrastructure, buildings, or international travel.
Out of the total budget proposed for 2 years, the non-recurring should be limited to 50% and remaining is for recurring items. Budget for non-recurring can be extended to 60% max, if the procurement is done from a foreign country. Remaining budget under non-recurring should be borne by the Host Institute. 10% of the total budget will be allocated for TEC/TBI engagement.
It is desirable to have the contribution of the Industry and host institution/grantee institution for the non-recurring cost of the project. No financial support will be provided to industry. An endorsement letter from the participating industry/stakeholder with a detailed breakup of their contribution for the proposed project has to be submitted.
Proposals must be submitted online through the DST portal (https://onlinedst.gov.in/). The submission process is divided into two phases: Concept Note and Full Proposal. Only shortlisted PIs from Phase 1 will be invited to submit a full proposal.
The concept note must provide a clear definition of the problem, relevant metrics, evidence supporting the Technology Readiness Level (TRL), and comprehensive scientific and technical details. Declaration and signed endorsement letters of the collaborating partners including industry can be submitted in the later stages while submitting the full proposals.
The proposals falling under TRL3 to 6 [TRL3 – Experimental proof of concept, TRL 4 – Technology validation in lab, TRL 5 – Technology validation in relevant environment, TRL6 – Technology demonstrated in relevant environment] are only to be submitted. Proofs for achieving the claimed TRL/Proof of concept has to be enclosed. The fundamental R&D proposals will not be supported under this call.
The investigators/R&D Group must have adequate experience and expertise in the relevant area of the proposal. Proposals should be based on innovative technologies/ideas and have specific, concrete, quantifiable objectives/deliverables.
The technology demonstration and translational plan by involving TEC/TBI should be clearly spelled out with achievable milestones, timelines, and a justifiable budget requirement. The end product of development shall be transferred to industries/suitable stakeholders for technology implementation.
PI is required to submit an undertaking validated by the Head of the Institute/Competent Authority, stating that if the proposed industry partner withdraws from the project in midway, the host institute will contribute the necessary funds/support to ensure the successful achievement of the intended objectives of the project. A PI can submit only one proposal against this DST-AMT-2025 Call. Submission of more than one proposal from a PI would be liable for disqualification.
The last date for submission is 31.07.2025, 5.00 P.M. Applicants are advised to complete the online submission well in advance to avoid last-day rush.
For any queries, please contact:
Dr. Krishna Kanth Pulicherla, Scientist ‘E’, Technology Translation and Innovation Division, Department of Science & Technology, Email: kkpulicherla.dst@gov.in
Shri Anil Kumar Meena, Scientist ‘B’, Technology Translation and Innovation Division, Department of Science & Technology, Email: anilmeena.99@gov.in
Research Grant
45000000 INR
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6000000 INR
Research Grant
45000000 INR
Seed and Start Up Grant
5000000 INR
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